Features | Benefits |
---|---|
Very low surface energy | Easy de-molding, prevent damage and contamination of parts and the mold |
Molding temperature range up to 165°C (330°F) | Suitable for moderate temperature resin systems |
Chemically inert | Exceptional chemical resistance in aggressive environments |
Available with pigment | For easy identification, customized products |
Available with C-Treatment | Allows the film to be sealed easily to itself and other surfaces |
Typical Properties | Test Method | Value | Units |
---|---|---|---|
General | |||
Specific Gravity | ASTM D-792 | 1.70-1.76 | |
Yield (1 mil) | 22.5 (110) | m2/kg (ft2/lb) | |
Water Absorption, 24 hr. | <0.03 | % | |
Mechanical | |||
Tensile Strength @ Break (RT) | ASTM D-882 | 48 (7,000) | MPa (psi) |
Elongation @ Break (RT) | ASTM D-882 | 400 | % |
Tensile Modulus (RT) | ASTM D-882 | 1100 (160,000) | MPa (psi) |
Propagation Tear Strength, 1 mil | ASTM D-1922 | >2.9 (0.65) | N(lbf) |
Electrical | |||
Dielectric Strength, 1 mil | ASTM D-149 | 215 (5,500) | kV/mm (V/mil) |
Dielectric Constant, 1 kHz | ASTM D-150 | 2.6 | |
Dissipation Factor, 1 kHz | ASTM D-150 | <0.0008 | |
Thermal | |||
Flammability | UL 94 | V-0 | |
Melt Point | ASTM D-3418 | 250-270 (482-518) | C (F) |
Continuous Service Temperature | 165 (330) | C (F) | |
Specific Heat | 2000 (0.46) | J/(kg· oK) (BTU/(lb·oF)) | |
Coefficient of Thermal Conductivity | 0.238 (1.65) | W/(m· oK) BTU·in/(hr·ft2·oF) | |
Limiting Oxygen Index | ASTM D-2863 | 31 | % |